Event
MSE Seminar: Dr. Carl Dohrman, Raytheon
Wednesday, December 9, 2026
3:30 p.m.
Room 2108 Chemical and Nuclear Engineering Building
Sherri Tatum
301-405-5240
statum12@umd.edu
Electronic and Photonic 3D Heterogeneous Integration for Defense Applications
Abstract: For more than 20 years, Raytheon has been advancing the state of the art in electronic and photonic 3D heterogeneous integration. Under the DARPA COSMOS program, Raytheon developed novel monolithic InP BiCMOS technology for advanced mixed signal integrated circuits. More recently, Raytheon is advancing photonic 3D heterogeneous integration through the DARPA HAPPI program. Under HAPPI, Raytheon is demonstrating a compact, wafer-level 3D photonic integrated circuit stacking technology. This presentation will review Raytheon advances in electronic and photonic heterogeneous integration in the COSMOS and HAPPI programs, as well as other select research efforts.
Bio: Dr. Carl Dohrman is an Associate Director leading a portfolio of integrated photonics programs for Raytheon’s Advanced Technology business unit. He is the principal investigator of Raytheon’s project under the DARPA HAPPI program, which is developing integrated chip-to-chip photonic interconnect technology. He is also the PI of a program to develop a domestic manufacturing line for thin film lithium niobate (TFLN) wafers. Prior to Raytheon, Carl was a SETA at DARPA for over eight years, where he served as a subject matter expert in integrated RF and photonic materials, devices, and systems. Carl’s Ph.D. thesis pioneered a novel multilayer substrate for heterogeneous integration, which was adopted by Raytheon on the DARPA COSMOS program to demonstrate advanced InP BiCMOS circuits. Carl received a B.S. degree from the University of Illinois and a Ph.D from MIT, both in materials science for electronics and photonics.
